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Residual Stress

The objectives and activities of the Residual Stress Technical Division are:

 

  • To advance the practice and use of residual stress measurements and analysis through information exchange among users and developers.
  • To encourage and disseminate technical knowledge concerning residual stress measurements and analysis through publications, conference presentations, training courses, round-robin studies and peer information exchange.

 

Officers
Chair

Adrian DeWald

Hill Engineering, LLC

atdewald@hill-engineering.com

Vice Chair

Gary Schajer
University of British Columbia
schajer@mech.ubc.ca

Secretary  

 

Bylaws

Residual Stress Division - Updated May 2011

A meeting of the Residual Stress Technical Division (RSTD) was held during the 2010 SEM Annual Meeting in Indianapolis, with sixteen members in attendance. 

 

The RSTD officers for the 2010/2011 year were confirmed:  Gary Schajer will remain as RS TD Chair until 2011, and Jay Hanan agreed to serve as the Secretary for the TD until 2012.  Gavin Horn completed his term as Vice Chair, but kindly agreed to continue for one more year to complete the slate of three officers of the TD. 

 

The RSTD was pleased to note that six residual stress sessions were held at the 2010 SEM meeting, forming a more than 60% increase in the number of papers accepted over the previous year.  The sessions were: Residual Stress Measurement Techniques (32 attendees), Destructive Methods for Measuring Residual Stresses (41 attendees), Optical Methods for Measuring Residual Stresses (28 attendees), Nondestructive Methods for Measuring Residual Stresses (21 attendees) and (2 sessions) Residual Stress and Fatigue and Fracture (18 attendees).  Three of the sessions were co-organized with the Optical Methods and Fatigue and Fracture TDs.

 

Based on the good RSTD showing at the 2010 meeting, it was decided to make a request to have a specific Residual Stress track at the 2011 meeting: "Engineering Applications of Residual Stress."  The following sessions were suggested: “Residual Stress Measurement Techniques”, organized by Gary Schajer, “New Developments in Residual Stresses”, organized by Cev Noyan, “Modeling Residual Stresses (Experimental Validation in RS)” organized by Mike Hill and Mike Prime  “Residual Stresses in Composites”, organized by Mike Steinzig, “Residual Stress and Reliability in MEMS and NEMS”, a joint session with the MEMS TD organized by Gavin Horn with Gordon Shaw, and a joint session with the Fatigue and Fracture TD, organized by Jay Hanan with Matt Cavalli. 

 

The RSTD expressed appreciation of the strong impact of the keynote speakers, Cev Noyan from Columbia University and Philip Whitehead from Stresscraft Limited.  In addition, the joint sessions with the Optical Methods TD and the Fatigue and Fracture TD were very constructive.  It was decided to continue similar arrangements at the 2011 SEM meeting. 

 

The Residual Stress Technical Division continues to enjoy strong participation in the sessions and collaborations with other TDs within SEM.  Another good showing at the 2011 SEM meeting is anticipated 

SEM

 

 

 

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